Written by Samsung
Samsung Electronics and KDDI today announced the companies have signed a Memorandum of Understanding (MOU) to form a 5G Global Network Slicing Alliance. Through this new alliance, the companies will work together to introduce an array of commercial 5G network slicing services and assess new business models based on this innovative technology.
This announcement follows the companies’ ongoing efforts in the advancement of network slicing, a market that is expected to grow at over fifty percent annually from 2023 to 2030. KDDI and Samsung conducted a field trial in January 2023, which successfully completed Service Level Agreements (SLA) assurance network slicing on a live 5G standalone (SA) network in Tokyo, Japan. The companies also demonstrated network slicing with a RAN Intelligent Controller (RIC) for the first time in the industry back in 2020.
“KDDI has been at the forefront of network slicing innovation, and we are excited to take another significant step forward with Samsung to show how this technology can augment 5G experiences for consumers and businesses,” said Toshikazu Yokai, Chief Network Officer, Managing Executive Officer, Deputy General Manager of Technology Sector at KDDI. “Through the strategic alliance, we not only aim to create new and immersive use cases, but also explore the infinite potential in transforming industries.”
